Design of Liquid Cooling Premises Using CFD for High Heat Dissipation Electronic Boards

Abstract

In datacenter, pharmaceutical industry and many other places minimum or low temperature required. Now days higher power electronic systems is used it large amount of heat dissipate but for such electronic systems cooling technology not much more change. Because of large heat dissipation few times electronic device like laptop burns. Also some time thermal injuries placed in a patient’s. From many year study conducted for fluid flow and heat transfer behavior in microchannel heat sinks for application in electronic cooling. Cooling generally two types i.e. air cooling and liquid cooling. Liquid cooling compare to air cooling is more effective for cooling on electronic chip (electronic device).

The CFD (Computational Fluid Dynamics)) IS powerful engineering analysis tool. The use of CFD to enable the predictions of the temperature distribution in circuit boards i.e. electronic chips The CFD model was required to incorporate the effects of mixed convection on surfaces, heat generation in the modules, and conduction inside the board. Appropriate convection heat transfer coefficients and boundary conditions resulted in a temperature distribution in the board and chips.